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;my applications goyordering code ??y features 422 7 6 5 4 3 2 1 f i 2 1 2 b 2 4 5 0 2 1 C t fi ? *t???? ~ ? ~ ? ~ ? ~ ?n
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lanz???a? 1 ???? operating temp. ?30?85? 3 212 2.01.25
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: mhz ? 2450 2400?2500 0620 470?770 4 ?? b l c ???? 2 ?????? ????? ?????? y?? ? 7 ?7?? 01? x?7 6 a
?t a?e?? fi filters for high frequency 1 device code 3 212 2.01.25 dimensions code |mm electrode code 2 with plating 7 spec code 01? individual spec 6 packaging ? t tape & reel 1?? 1blank space 4 special code b l c band pass filter low pass filter balanced filter 5 frequency |mhz example 2450 2400?2500 0620 470?770
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goyexternal dimensions 6 high frequency dielectric component 423 1.25 ? 0.15 0.049 ? 0.001 1.0max. 0.039max. 0.20 ? 0.15 0.008 ? 0.006 0.20 ? 0.15 0.008 ? 0.006 0.35 ? 0.20 0.014 ? 0.008 0.30 ? 0.20 0.012 ? 0.008 0.30 ? 0.20 0.012 ? 0.008 2.00 ? 0.15 0.079 ? 0.006 nc balance balance gnd dc unbalance gnd gnd 2.00 ? 0.2 0.079 ? 0.008 0.4 ? 0.2 0.015 ? 0.008 1.25 ? 0.2 0.049 ? 0.008 1.0max. 0.039max. gnd i/o i/o gnd fi 212l type ?fi 212c245031 ?fi 212l062002,3 unit : mm inch unit : mm inch unit : mm inch gnd i/o i/o gnd gnd gnd ?fi 212b245021 gnd 1.25 ? 0.2 0.049 ? 0.008 0.2 0.5max. 0.020max. 0.3 ? 0.2 0.012 ? 0.008 2.00 ? 0.2 0.079 ? 0.008 1.6 ? 0.2 0.064 ? 0.008 0.2 0.1 0.008yy 0.008 0.004 0.2 0.2 0.1 0.008yy 0.008 0.004 ??aa ~ ?>$?
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qypart numbers electrical characteristics typical characteristics passband frequency insertion loss at passband ripple at passband v.s.w.r. at passband attenuation impedance 470-770mhz 0.9dbmax. 470-600mhz 25 deg-c 1.1dbmax. 470-600mhz ? 30 ? 85 deg-c 1.5dbmax. 600-710mhz 25 deg-c 1.7dbmax. 600-710mhz ? 30 ? 85 deg-c 3.4dbmax. 710-770mhz 25 deg-c 3.7dbmax. 710-770mhz ? 30 ? 85 deg-c 1.2dbmax. 470-710mhz 2.0max. 470-710mhz 5dbmin. 830-840mhz 25dbmin. 888-925mhz 25dbmin. 940-960mhz 27dbmin. 1429-1453mhz 26dbmin. 1920-1980mhz 26dbmin. 2400-2500mhz 50
actual data 0.65db 1.25db 2.9db 0.85db 1.5 9.5db 32db 34db 33db 29.5db 29.5db y? ~ fi212l062002 0 ? 10 ? 20 ? 30 ? 40 ? 50 100 1350 2600 frequency | mhz attenuation | db s21 s11 p. 423 ??aa part numbers ?
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$ electrical characteristics a packaging ?t
q reliability data ?; w?? precautions p. 423 p. 425 p. 426 ?3???? selection guide p. 17 etc p. 428
424 passband frequency 2400-2500mhz actual data insertion loss at passband 1.6db max. 25deg-c 1.25db 1.9db max. ? 30 ? 85deg-c ripple at passband 1.0db max. 0.33db v.s.w.r. at passband 2.0 max. 1.29 attenuation 25db min. 1710-1910mhz 31.1db 20db min. 4800-5000mhz 23.9db impedance 50
~ fi 212b245021 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 ? 80 ? 90 ? 100 1000 2000 3000 frequency | mhz attenuation | db s21 s11 ??aa ~ ?>$?
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qypart numbers ~ electrical characteristics ~ typical characteristics ~ fi 212c245031 u = balanced port impedance balanced port impedance passband frequency insertion loss at passband ripple at passband a mp. balance at passband phase balance at passband single ended port v.s.w.r at passband balanced port v.s.w.r at passband a ttenuation specification 50
conjugated to csr bc3 2400 ? 2500 mhz 3.7db max. 25deg-c 4.0db max. ? 30 ? 85deg-c 1.0 db max. 2.0 db max. 180 ? 10 deg 2.0 max. 2.0 max. 35 db min. 880 ? 960 mhz 20 db min. 1710 ? 1990 mhz 20 db min. 1990 ? 2170 mhz 20 db min. 4800 ? 5000 mhz actual data ? ? ? 3.3 db 0.24 db 0.87 db 178 ? 179.7 deg 1.4 1.3 54.2 db 43.3 db 23.9 db 49 db 5.0 3.0 1.0 ? 1.0 ? 3.0 ? 5.0 2.2 2.3 2.4 2.5 2.6 2.7 frequency | ghz amplitude balance | db 10 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 0.5 1.5 2.5 3.5 4.5 5.5 frequency | ghz attenuation | db 20 15 10 5 0 5 10 15 20 2.2 2.3 2.4 2.5 2.6 2.7 frequency | ghz phase balance | deg 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 0.7 1.7 2.2 1.2 2.7 frequency | ghz attenuation | db sds21 sss11 sdd22 ~ fi 212c245031 u = balanced port impedance balanced port impedance passband frequency insertion loss at passband ripple at passband a mp. balance at passband phase balance at passband single ended port v.s.w.r at passband balanced port v.s.w.r at passband a ttenuation specification 50
conjugated to csr bc3 2400 ? 2500 mhz 3.7db max. 25deg-c 4.0db max. ? 30 ? 85deg-c 1.0 db max. 2.0 db max. 180 ? 10 deg 2.0 max. 2.0 max. 35 db min. 880 ? 960 mhz 20 db min. 1710 ? 1990 mhz 20 db min. 1990 ? 2170 mhz 20 db min. 4800 ? 5000 mhz actual data ? ? ? 3.3 db 0.24 db 0.87 db 178 ? 179.7 deg 1.4 1.3 54.2 db 43.3 db 23.9 db 49 db 5.0 3.0 1.0 ? 1.0 ? 3.0 ? 5.0 2.2 2.3 2.4 2.5 2.6 2.7 frequency | ghz amplitude balance | db 10 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 0.5 1.5 2.5 3.5 4.5 5.5 frequency | ghz attenuation | db 20 15 10 5 0 5 10 15 20 2.2 2.3 2.4 2.5 2.6 2.7 frequency | ghz phase balance | deg 0 ? 10 ? 20 ? 30 ? 40 ? 50 ? 60 ? 70 0.7 1.7 2.2 1.2 2.7 frequency | ghz attenuation | db sds21 sss11 sdd22 passband frequency insertion loss at passband ripple at passband v.s.w.r. at passband attenuation impedance 470-770mhz 0.7dbmax. 470-600mhz 25 deg-c 0.9dbmax. 470-600mhz ? 30 ? 85 deg-c 1.5dbmax. 600-710mhz 25 deg-c 1.7dbmax. 600-710mhz ? 30 ? 85 deg-c 3.3dbmax. 710-770mhz 25 deg-c 3.7dbmax. 710-770mhz ? 30 ? 85 deg-c 1.2dbmax. 470-710mhz 2.5max. 470-710mhz 15dbmin. 830-840mhz 25 deg-c 11dbmin. 830-840mhz ? 30 ? 85 deg-c 15dbmin. 888-925mhz 15dbmin. 940-960mhz 7dbmin. 1429-1453mhz 8dbmin. 1920-1980mhz 8dbmin. 2400-2500mhz 50
actual data 0.5db 1.1db 2.5db 0.9db 1.6db 20db 22db 24db 10db 10.5db 11db yy? ~ fi 212l062003 0 ? 10 ? 20 ? 30 ? 40 ? 50 100 1350 2600 frequency | mhz attenuation | db s21 s11
6 high frequency dielectric component 425 ay packaging ?a?e??
go taping dimensions y??a? 212b??, 212c?? 8mm ? yembossed tape 0.315 inches wide ya? 212l?? 8mm ? ypaper tape 0.315 inches wide ?a?e??p tape material ?7 ? !?o?
:yminimum quantity a?yyy card board carrier tape ????
go reel size ???a?sy top tape strength ??a?wxu`?x<
$1m2to0.1?0.7nqs??b{ the top tape requires a peel-off force of 0.1?0.7 n in the direction of the arrow as illustrated below. ????? ? ~ ? leader and blank portion yy ??a? |pcs type embossed tape 212b 3000 212l 3000 212c 3000
a ?? a j
:? eia thickness standard quantity |pcs t ype mm inch ??a? embossed tape a?e??ay taped packaging 212b 212l 212c 0.90typ. 0.035 0.45typ. 0.018 0.90typ. 0.035 3000 3000 3000 unitmm inch type ??
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?e?? a?? max eia chip cavity insertion pitch tape thickness a b f k t 212b 1.5?0.25 2.3?0 . 2 1.6 0.3 0.059?0.008 0.091?0.008 4.0?0.1 0.063 0.012 212l 1.55?0.25 2.3?0 . 2 0.157?0.004 0.65 0.65 0.061?0.008 0.091?0.008 0.026 0.026 212c 1.55?0.25 2.3?0 . 2 4.0?0.1 y1.6y 0.3 0.061?0.008 0.091?0.008 0.157?0.004 0.063 0.012
high frequency dielectric component 6 427 1. operating temperature range 2 . storage temperature range 3 . resistance to flexure of substrate 4 . adhesion of electrode 5 . solderability 6 . resistance to solder heat 7 . thermal shock 8. humidity steady state 9 . high temperature life test 10 . low temperature life test ?30?85? ?30?85? no mechanical damage. characteristics: shall satisfy the electrical characte ristics. appearance: no signi?cant abnormality. 75? or more of immersed surface of terminal electrode shall be covered with fresh solder. characteristics: shall satisfy the electrical characteristics. appearance: no signi?cant abnormality. characteristics: shall satisfy the electrical characteristics. appearance: no signi?cant abnormality. characteristics: shall satisfy the electrical characteristics. appearance: no signi?cant abnormality. characteristics: shall satisfy the electrical characteristics. appearance: no signi?cant abnormality. characteristics: shall satisfy the electrical characteristics. appearance: no signi?cant abnormality. tnote?20 to +35? in taped packaging warp 2mm testing board glass epoxy-resin substrate thickness0.8mm applied force 5n duration10 sec. solder temperature 230?5? duration4?1sec preconditioning immersion into ?ux. immersion and removal speed25 mm/sec. preheating 150? for 2 min. solder temperature 260?5? duration5?0.5sec. preconditioning immersion into ?ux. immersion and removal speed25 mm/sec. recovery 2 to 3 hrs of recovery under the standard condition after the removal from test chamber according to jis c 0025. conditions for 1 cycle number of cycles100 mounting method soldering onto pc board. recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. temperature 40?2? humidity90 to 95?rh duration96 hrs recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. temperature: 85?2? duration: 96 hrs recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. temperature: ?40?2? duration: 96 hrs recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. step temperature ? duration min 1 ? 40 ? 3 ? 30 ? 3 2 room temperature within 3 3 85 ? 2 ? 30 ? 3 4 room temperature within 3 reliability data test methods and remarks item speci?ed value r-230 note on standard condition: "standard condition" referred to herein is de?ned as follows 5 to 35 ? of temperature, 45 to 85 ? relative humidity and 86 to 106 kpa of air pressure. when there are questions concerning measurement result: in order to provide correlation data, the test shall be conducted under condition of 20 ? 2 ? of temperature, 60 to 70 ? relative humidity and 86 to 106 kpa of air pressure. unless otherwise speci?ed, all the tests are conducted under the "standard condition".
high frequency dielectric component 6 429 precautions stages precautions technical considerations 1 . pcb design land pattern design land pattern dimension examples ?fi 212 l type yfi 212l062002, 3 ? fi 212b245021 ? fi 212c245031 2 . soldering 3 . storage conditions 1 . if the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/ packaging materials may take place. for this reason,components should be used within 6 months from the time of delivery. if exceeding the above period, please check solderability before using the inductors. storage 1 . to maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. humidity should especially be kept as low as possible. k recommended conditions ambient temperature ?20?35? humidity below 60?rh the ambient temperature must be kept below 30 ? . even under ideal storage conditions inductor electrode sol- derabi tlity decreases as time passes, so inductors should be used within 6 months from the time of delivery. k the packaging material should be kept where no chlorine or sulfur exists in the air. 1.65 0.95 0.95 0.35 0.75 0.75 0.75 unit : mm unit : mm 0.65 0.65 0.73 0.73 1.57 0.35 0.35 0.35 1.575 conditions for re?ow soldering for reference re?ow plo?le yyyyyyyy please contact of our of?ces for further details of speci?cations. all of the standard values listed here are subject to change without notice due to technical improvements. therefore,please check the speci?cations carefully before use. e?? 260 ??< 10 | '?150? 60 ? ?c?230 ?? 40 | t??qx?i9sqw)u 100 ? ??:xs|w - aqs??b{ 9s? 300 200 100 0 ?? peak 260? max 10 sec max t ceramic chip components should be preheated to within 100 to 130? of the soldering. t assured to be reflow soldering for 2 times. temperature ? 300 200 100 0 preheating 150? 60 sec min gradually cooling heating above 230? 40 sec max 1.1 1.0 0.2 1.0 1.1 0.45 0.45 0.85 1.55 0.5 1.1 unit : mm 0.35 0.9 0.85 0.35 1.5 0.9 0.65 unit : mm 0.2 0.2 0.25 0.25

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